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Cold Bump Pull Tweezer Tip

Price range: € 2.000,00 through € 3.300,00

This tweezer tip (gripping jaw) enables to perform Cold Bump Pull tests with USB tweezers (Sigma and Classic compatible)

SKU: TOT610 Category: Tag:

Description

CBP back reliefTweezer tips are the “gripping jaws” which you need for USB tweezers. This tool is ideal for solder and gold balls and to perform Cold Bump Pull tests. They are also usable for some other applications like copper pillar.

The cavities in the jaws reform the ball to apply the maximum test force with minimal effect to the bond area. They should reform the ball to a “mushroom” shape, ideally with the “stem” of the mushroom shape being larger or the same diameter as the bond. This reforming process has a far smaller effect to the bond area than a standard shear test where ball deformation occurs over typically 30% of the bond diameter before achieving the peak test force.

These tips are compatible with Sigma and Classic bond testers. Besides a range of standard tips, we design custom tips to suit many different geometries for multiple applications.

What kind of balls can be tested?

Using the Cold Bump Pull test method, it is not always possible to effectively grip the balls. The ratio of ball diameter to height is an important metric when determining the testability of a part. The threshold ratio of testability with tweezers is roughly defined by diameter / height < 2.

Additional information

Weight 0,5 g
Compatible with

Classic, Sigma

Tip size

50 µm, 80 µm, 100 µm, 115 µm, 150 µm, 200 µm, 250 µm, 300 µm, 350 µm, 400 µm, 450 µm, 500 µm, 550 µm, 600 µm, 650 µm, 700 µm, 750 µm

Article numbers

50 µm
TOT610050
80 µm
TOT610080
100 µm
TOT610100
115 µm
TOT610115
150 µm
TOT610150
200 µm
TOT610200
250 µm
TOT610250
300 µm
TOT610300
350 µm
TOT610350
400 µm
TOT610400
450 µm
TOT610450
500 µm
TOT610500
550 µm
TOT610550
600 µm
TOT610600
650 µm
TOT610650
700 µm
TOT610700
750 µm
TOT610750
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